STEMP Solutions trainers bring below unparalleled expertise to shape the future of global talents

  • Average 20+ years of individual trainer semiconductor experience at top international manufacturing plants

  • 150+ years of collective experience of trainers

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Trained Professionals

Years Average Trainer Experience

20+

Target Audience:

  • STEM students of age 15-18 years

  • Final year or placement year of an Engineering graduate including Physics and Chemistry

  • New hires, entry level employees of any semiconductor, Electronics, high tech precision engineering

  • Interactive AI based digital twin model simulators

  • Both short term and curriculum courses are highly customizable

  • Industry Case Studies and Videos included to enhance participants comprehension

Short Term Courses

  • Training Duration : 1 day to 2 weeks

  • On-site or online training

    • Semiconductor Industry and Ecosystem

    • Introduction to Semiconductor Manufacturing

    • Introduction to Wafer Fabrication

    • Introduction to Semiconductor Packaging

    • Advanced Semiconductor Packaging

    • Semiconductor World for non-Engineers

    • Moore's Law, More than Moore

    • Advanced Scaling, Technology evolution, FinFETs, Ultra-thin Body SOI

    • Silicon Wafers

    • Cleanrooms, Environmental monitoring, Facilities management

    • CMOS Process Integration

    • More than Moore Technologies

    • MOSFET Physics and Reliability

    • Manufacturing Execution System [MES]

    • 5S, Safety, Quality, Delivery, Cost, Capacity, Utilization, Yield, KPIs

    • Manufacturing Quality Assurance overview

    • Project Management (PMP/Agile)

    • Lean Six Sigma

    • Defects and Wafer Inspection

    • Factory overview - Modules, Equipment, Manufacturing

    • Process, Equipment, Metrology

      • Oxidation, Wet Clean

      • Diffusion, Furnace & RTP

      • Ion Implant

      • Photolithography

      • Etch - Wet & Dry

      • Metallization

      • CVD (Chemical Vapor Depositition)

      • CMP (Chemical Mechanical Planarization)

      • Wafer level testing

    • Advanced Photolithography - Resolution Enhancement, Multiple Patterning, EUV

    • Atomic Layer Processing - ALD, ALE

    • Failure Analysis (FA) Techniques

    • Process, Equipment, Metrology

      • Wafer Back Grinding

      • Wafer Dicing

      • Die Attach, Flip Chip

      • Wire Bonding

      • Encapsulation

    • Flip Chip Attach

    • Reliability of Wire Bonded Packages

    • Reliability of Flip Chip Packages

    • 3D Packaging, TSV

    • Applied FMEA [Failure Mode Effects and Analysis]

    • Automotive mindset, Control Plans

    • SPC [Statistical Process Control], OCAPs

    • Applied MSA [Measurement Systems Analysis]

    • Change Management in the Semiconductor World

    • Quality Management System and Audits

    • 8D Problem Solving, Failure Analysis

    • QC Tools, Incoming & Outgoing QA

Curriculum Courses

  • 3 - 15 weeks intensive training

  • On-site or online training and On the Job (OJT) training

  • Combine any short term individual courses in wafer fabrication and/or packaging to form a curriculum

    • Specification Definition

    • System Modelling

    • RTL Design & Simulation

    • Synthesis & Functional Verification

    • Static Timing Analysis (STA)

    • Design for Testability (DFT)

    • Netlist Extraction

    • Floor Planning, Placement & Power Planning

    • Clock Tree Synthesis (CTS)

    • Physical Verification

    • Design for Manufacturability (DFM)

    • Netlist Extraction

    • Post Layout Simulation & Verification

    • GDS II Generation & Tape-out

    • Specification Definition

    • Architecture Design

    • Behavioral Modelling

    • Circuit Design

    • Layout Design

    • Pre/Post Layout Simulations

    • GDS II Generation & Tape-out